Eresco Series

The ERESCO MF4 portable industrial X-ray generators are designed for reliability in some of the world’s toughest conditions. The new user interface for controlling and monitoring the X-ray setup features graphic visualization and menu driven operation to optimize productivity.

• Highest power output, with best image definition in its class
• High X-ray dose permitting short exposure times with associated increases in productivity
• Operation with 100% Duty Cycle at 30°C
• Light weight and compact design
• Robust construction of control and tube heads allowing operation in rugged environments (IP65)
• Low power consumption allows for longer battery life, flexible operation with portable power supplies or battery packs and less energy use
• On-Board power electronics allow autonomous operation and integration within crawlers
• Range of designs, including air-cooled, water cooled, panoramic output and small focal spot
• Wide range of accessories, including stands and carriages to facilitate positioning during exposure setup

Microfocus & Nanofocus Tubes

MIcrofocus & Nanofocus Tubes are used to generate highest-resolution X-ray technology provides the means necessary to inspect such components.

Typical inspection tasks includes:

• Automated solder joint inspection
• Inspection of bond wires and bonding areas
• Void analysis of conductive and non-conductive die bonds
• Analysis of discrete components such as capacitors and inductors

Isovolt Series

ISOVOLT Titan series offers significant improvements in ease of operation, controllability and on-board logic to allow greater operational productivity and reliability.

• Single or three phase mains available
• High stability
• High accuracy
• Precise reproducibility
• Short ramp-up time (< 1.5 sec)
• Extremely low ripple
• High dose rate output
• Intelligent X-ray tube warm-up
• Large LCD display
• Clear text messages in up to 16 languages
• Speed sensitive rotary control (kV, mA)
• Rugged and reliable design
• Proven reliability
• Full on-site maintainability
• Local and remote diagnostics
• Systems Integration via standard RS 232C optional: RS 422 or RS 485 / Profibus (EN 50170) / Ethernet
• Remote operation up to 100 m (300 ft.)

• Low energy high power applications - Composite materials, low density plastics. Thin wall light-weight designs.
• High energy, low power applications - Thick Aluminium castings with different wall thicknesses Heavy steel- or gray casts with different wall thickness range.
• High Energy, High Power applications - Industrial CT for cast alloy materials. Improved POD on high density and thick material through higher current capability.
• Fine tuned applications for measurement and calibration - Perfect fit for a number of scientific or life science applications as reference and calibration equipment.
• Applications in integrated solutions - Standard system interface to allow communication to OEM solutions and systems. Modular and compact design, performs in various settings and can be programmed externally Robust design for 24/7 operation.

Computed Radiography

• No darkroom facilities/trucks needed (for standard image plate sizes)
• Eliminate processing chemicals and chemical disposal/silver recovery
• Improved image interpretation and inspection quality level with Flash!Filters
• Consistent & operator–independent results with the Automated WT Measurement tool
• High reduction in retakes due to the wide dynamic range of the imaging plates
• No development time, as images are immediately available after scanning
• High reduction in storage space when archiving digital images
• Data management (trending) and data sharing advantages
• Fully DICONDE compliant

Real Time Radiography

Amorphous selenium (a-Se) FPDs are known as “direct” detectors because X-ray photons are converted directly into charge. The outer layer of the flat panel in this design is typically a high-voltage bias electrode. X-ray photons create electron-hole pairs in a-Se, and the transit of these electrons and holes depends on the potential of the bias voltage charge. The charge pattern is then read by a TFT array in the same way images produced by indirect detectors are read.

Digitizer

Film Digitizers FS50 / FS50B are designed to provide high-end performance in film digitizing, offering superior quality at high throughput. The steel housing gives the robustness needed for the industrial environment of NDT applications. All standard film formats can be digitized, up to a width of 35 cm (14 in.), without length limitation in any resolution between 50 μm and 500 μm. The FS50B is the first and only digitizer on the market that can handle the full density range (D = 0 up to 4.70 D) in one working range with the requested contrast sensitivity. This makes the scanner meet the requirements for class DS film digitizers, according to EN 14096 part 2. This classification has been evaluated and confirmed by BAM, the German Federal Institute for Materials Research and Testing.

UCI

• Combined hardness tester for quasi-static hardness testing according to the UCI method (ASTM A1038) and dynamic hardness testing according to the rebound method (ASTM A956)
• UCI probes for hardness testing of fine-grained materials having different masses and shapes or heat-treated surfaces.
• Rebound impact devices for hardness testing on large, coarse-grained components, forgings, and cast materials
• Automatic scale conversion to HV, HB, HRC, HRB, HS, HL and N/mm2
• Operation by keys and/or integrated touch screen, easy input of alphanumerical data
• Power supply: mains adapter (100 V - 240 V) or NiMH battery pack MIC 20-BAT (internal charging)
• Internal data memory for approx. 5,000 measurement series
• Quick and easy calibration to various test materials. Calibration data are saved and can be recalled
• Non-directional measurement without input of any correction factors
• Large color TFT display shows all necessary information during measurement, such as average, single value, or statistical data at a glance
• Clearly arranged data memory to save measurement results in an easy and structured way. Measurement series can be recalled and edited.

Rebound

• Measurement of hardness independent of impact direction (without input of any correction values) due to patented signal processing
• Standardized according to ASTM A956
• Automatic conversion of hardness to HV, HB, HRC, HRB, HS, HL and N/mm2
• Different impact devices dependant on application.

USM GO

The well-established and proven ultrasonic flaw detector USM Go is available with joystick operation or as the new USM Go+ with arrow-key operation. The USM Go and the new USM Go+ are both extremely portable and robust ultrasonic flaw detectors. Both units have a small protected hand-held housing with the biggest A-Scan display in its class and features which are essential for inspections based on common codes and standards.

The USM Go is the first choice when top UT performance, combined with ultra-portability and one-hand joystick operation is required and furthermore has the option to upgrade to a thickness gauge.

The new USM Go + is the youngest member of the USM Go family equipped with an arrow-keypad and the latest industrial electronics. The state-of-the-art technology contributes to the improved UT performance of the new USM Go + .One prime example is the outstanding Near Surface Resolution which allows a reliable detection of defects located just below the surface of the test piece.

Apart from the different operational devices the joystick or the arrow-keypad, the operation and the menus of both instruments are the same. The accessories are inter-changeable with both instruments. And even the stored instrument settings of the USM Go can be used with the new USM Go + and vice versa which will ease any ultrasonic inspector’s work but will ensure that proven settings can continue to be used with new equipment and even shared with other USM Go / USM Go+ inspectors.

• 850 g (1.87 lb.) total weight incl. batteries.
• A-Scan recording as video on SD-Card.
• trueDGS® Defect Sizing with highest available accuracy.
• Back wall Echo Attenuation helps to detect extreme small defects.
• IP67 Protection.
• 800 x 400 bright colour LCD (>200cd/m²).
• USM Go is extendable to DMS Go Thickness Gage instrument

• Eresco Series
• Microfocus & Nanofocus Tubes
• Isovolt Series

Ectane2

Surface Array and Tube Inspection Test Instrument.

• Eddy current testing (ECT)
• Eddy current array (ECA)
• Tangential eddy current array (TECA™)
• Remote-field testing (RFT)
• Near-field testing (NFT)
• Near-field array (NFA)
• Magnetic flux leakage (MFL)
• Internal rotating inspection system (IRIS) ultrasonic testing

Autosigma 3000 - Handheld Eddy Current Inspection

The AutoSigma 3000 gives accurate operation in an easy to use package that is both light and rugged. Designed for operator convenience, the lightweight, battery powered unit is easy to carry and easy to hold during inspections. The 500kHz frequency allows inspection of thin materials using the standard probe. The 60kHz setting is the aerospace industry standard.

• High accuracy 0.8 to 110% IACS (0.45-64 MS/m) conductivity measurement +/- 0.1 at 10% IACS
• Light weight at only 0.4kg
• Temperature compensation (0 to 40-deg C)
• Selectable Frequency (60 or 500 kHz)
• Clear Display with backlight
• Data Logging (500 Readings in up to 50 Files)

LYFT

     Corrosion under insulation (CUI) is possibly the greatest unresolved asset integrity problem in the industry. Current methods for measuring wall thickness over insulation (liftoff) without removing it all have severe limitations. Now, Eddyfi introduces Lyft — a high-performance reinvented pulsed eddy current (PEC) solution. This patent-pending system features a portable, state-of-the-art instrument, real-time C-scan imaging, fast data acquisition (up to 15 readings per second) with grid-mapping and dynamic scanning modes, and flexibility with long cables and an extension pole. The Lyft standard probes can also scan through thick metal and insulation, as well as aluminum, stainless steel, and galvanized steel weather jackets.

• New extended range of probes supporting wall thicknesses up to 102 mm (4 in) and insulation thicknesses up to 305 mm (12 in)
• Grid-mapping and dynamic scanning both are possible
• Portable : Lyft weighs only 6.6 kg (14.5 lb)

Mentor EM with Mentor Create

Put expertise right in your hands. Mentor EM allows you to easily access on-device workflow applications that efficiently guide the inspector while capturing electromagnetic (eddy current) inspection data. Real-time collaboration with remote experts allows fast and accurate indication confirmation. No more stacks of paperwork or questionable inspection calls, just easy and efficient nondestructive testing for weld, aerospace (including rotary) and general purpose inspections.

• Customize on-device workflow applications
• Easily readable touchscreen display that works while wearing gloves
• Instantly connect with other experts
• Base your next steps on real-time readings
• Immediately access your service bulletins
• Easily download software upgrades

MFL